Restrictions on U.S. chips have pushed the Chinese government to invest billions into its domestic supply chain.
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Latest example of the AI boom’s circular financing comes as AI trade wobbles.
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TSMC reports its monthly sales figures for October on Tuesday.
TSMC is drafting plans to make 3D DRAM memory chips at Nvidia's request, The Information reports, a move that would pit it against Samsung and SK Hynix.
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A report by The Information claims that the world’s biggest chipmaker is considering adding memory back into its portfolio, starting with next-generation 3D DRAM. With demand still outpacing supply and prices sky-high, the outlet says it could compete with memory giants Micron, Samsung, and SK Hynix to develop and produce 3D DRAM technology that stacks chips vertically for increased bandwidth, capacity, and power efficiency. [Link: TSMC Weighs Making Advanced Memory Chips to Capture More AI Spending | https://www.theinformation.com/articles/tsmc-weighs-making-advanced-memory-chips-capture-ai-spending?rc=v4bmzs | The Information]